Field Emission Scanning Electron Microscopy (FESEM) with EDS, EBSD and Lithography attachment

To examine metallic/non-metallic specimens’ microstructure at 2000000 X magnification with the resolution of 0.8nm at 15 kV; 1.3 nm at 1 kV
EDS (EDAX-make) attachment to detect its chemical composition
EBSD (EDAX-make) attachment to analyse the texture (orientation) of microstructure of metallic components

Lithography - Raith Lithography system (ELPHY Multibeam 20 MHz ) with Zeiss Electrostatic beam blanker attachment for electronic micro device fabrication